Daeduck Electronics will develop FC-BGA for Server-Data Center with Amkor
Daeduck Electronics will develop specialized flip-chip-ball gate arrays (FC-BGAs) for high-performance computing (HPC). FC-BGA substrates are semiconductors that connect the semiconductor chip to the main substrate. Daeduck Electronics promotes FC-BGAs, whose demand is growing rapidly, as the company’s future growth engine. Daeduck Electronics is developing FC-BGA substrates for HPC alongside Amkor Technology Korea, a global semiconductor packaging company, aiming for mass production in 2023.
FC-BGAs, developed by Daeduck Electronics, is a board that applies to 2.5D by integrating multiple input/output (I/O) terminals. 2.5D is a technology that increases transmission speed and reduces area by laying multiple individual semiconductor chips flat on a substrate. Daeduck Electronics has secured the ability to produce large substrates with more than 20 layers and a width of 100mm × 100mm or more.
The market outlook is also bright. Recently, the market for non-memory semiconductors, such as autonomous driving, servers and data centers, has developed rapidly thanks to artificial intelligence (AI) technology. High-performance semiconductor substrates are expected to be scarce until 2027. Daeduck Electronics first entered the FC-BGA market in 2020 and made large-scale plant investments in March and December of the last year, and in April this year. The cumulative investment in the facilities amounts to KRW 540 billion.
Sales are also soaring. Daeduck Electronics recorded KRW 1.92 trillion in consolidated sales and KRW 71.86713 billion in operating profit last year. Sales increased by 61.3% and operating profit by 2580% compared to the previous year. FC-BGA sales started in September 2020 last year. They expect to surpass last year’s performance.
Daeduck Electronics is reorganizing its commercial structure around FC-BGAs. It will reduce their share of low value-added products, such as flexible printed circuit boards (FPCBs) and high-activity multilayer printed circuit boards (MLBs), and focus on high-value substrates. By the end of 2024, it plans to build a production capacity of over KRW 700 billion in annual sales in FC-BGAs. Sales of the FC-BGA business this year are expected to exceed KRW 200 billion.
[Table] Daeduck Electronics FC-BGA Investment History
By Staff Reporter So-ra Park [email protected]